English
TranslateT256s Infrared Thermal Imaging: Lightweight, Plug-and-Play, AI Super-Resolution
The Sipeed T256s is a high-efficiency, portable thermal imaging and temperature measurement terminal designed specifically for developers and field engineers. It integrates a 256×192 resolution Long-Wave Infrared (LWIR) module combined with hardware-level AI Super-Resolution (AI ISR) technology. This allows the device to upscale thermal images locally to a visual clarity equivalent to 640×480. This technology enhances edge details and texture visibility, significantly improving the localization accuracy of tiny hotspots. The device features a unibody CNC aluminum alloy chassis, a 1.69-inch capacitive touchscreen, dual Type-C interfaces, and optional macro lens support. It offers plug-and-play UVC output with both Y16 and MJPEG modes.
Product Overview
The design of the T256s centers on three core pillars: Portability, Clarity, and Ease of Use. It is ideal for electronics R&D and repair, industrial maintenance inspections, HVAC diagnostics, and scientific research or education. Key highlights include local AI hardware super-resolution, standard UVC protocol compatibility, independent touch-based operation, flexible dual Type-C power design, precision macro detection, and a high-performance CNC aluminum housing for efficient heat dissipation.
Core Features
- On-Device AI Hardware Super-Resolution (ISR): Equipped with a built-in NPU hardware accelerator, the device enables a 2.5x super-resolution effect by default. Deep learning models enhance thermal clarity in real-time at the edge, effectively suppressing image noise compared to traditional interpolation algorithms.
- UVC Plug-and-Play: Supports standard UVC protocols, providing two output formats: Y16 (14-bit raw temperature data) and MJPEG (pseudo-color images). No proprietary drivers are required, ensuring compatibility with mainstream operating systems and video preview software.
- Standalone Touch Terminal: Featuring a 1.69-inch capacitive touchscreen, the device supports digital zoom, multi-point temperature measurement, pseudo-color switching, photo capture, and gallery browsing. It can function as an independent thermometer with just an external power supply, even when disconnected from a host PC.
- Flexible Dual Type-C Connectivity: Designed with both a Type-C male connector (to connect to hosts/phones) and a Type-C female port (for external power or daisy-chaining devices) to meet diverse application requirements.
- Precision Macro Detection: Supports an external macro lens (approx. 5cm working distance), allowing clear observation of tiny electronic components like 0402 packages on a PCB for rapid troubleshooting of thermal faults.
- All-Aluminum CNC Heat-Dissipating Chassis: The precision CNC machining ensures structural integrity while providing exceptional passive thermal dissipation. This prevents thermal drift, ensuring temperature accuracy and system stability during prolonged high-load operation.
Technical Specifications
| Item | Specification |
|---|---|
| Native Resolution | 256 × 192 @ 14-bit (Y14) |
| Super-Resolution Output | 640 × 480 (AI hardware-accelerated, 2.5×) |
| Temperature Range | -15°C to 150°C |
| Accuracy | ±2°C or ±2% of reading |
| Thermal Sensitivity (NETD) | < 50 mK @ 25°C |
| Frame Rate | 25 Hz |
| Field of View (FOV) | 56° × 42° |
| Display | 1.69-inch 240×280 capacitive touchscreen |
| Physical Interface | Type-C Male (Device) + Type-C Female (Host/Power) |
| Data Formats | Y16 (14-bit raw data), MJPEG (pseudo-color image) |
| Internal Storage | 32 MB Nand (for temporary snapshot storage) |
| Power Consumption | Standard USB 5V supply, low-power design |
| Housing Material | 6061 Aluminum Alloy, CNC Unibody |
Typical Application Scenarios
- Electronics R&D and Repair: Perform high-precision inspections of PCB solder joints and electronic components using the standard-issue macro lens to rapidly locate hardware faults such as short circuits and current leakage.
- Industrial Maintenance: Routine inspection of motors, power distribution cabinets, and transformers to identify overheating hazards.
- HVAC Inspection: Detect building thermal leaks, underfloor heating pipe layouts, and insulation defects.
- Scientific Research & Maker Projects: Utilize raw Y16 data for in-depth thermal analysis or secondary development using open-source tools.
Visual Illustrations
Product Tri-view and Dimensions
AI Super-Resolution Comparison (Left: Native; Right: AI ISR Enhanced)
PCB-level Precision Macro Detection
Industrial Field Inspection Example
